Camera module and optical device comprising same

ABSTRACT

A camera includes a lens barrel, a holder, a filter disposed in the holder, a circuit board having an aperture, a reinforcing member including a first region corresponding to the aperture and a second region in which the circuit board is disposed, and an image sensor disposed in the first region of the reinforcing member. The first region of the reinforcing member includes a protruding part protruding farther than the second region of the reinforcing member. The image sensor is disposed on the upper surface of the protruding part.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. Application No. 17/864,680,filed on Jul. 14, 2022, which is a Continuation of U.S. Application No.16/982,504, filed on Sep. 18, 2020 (now U.S. Pat. No. 11,418,687, issuedon Aug. 16, 2022), which is the National Phase of PCT InternationalApplication No. PCT/KR2019/003108, filed on Mar. 18, 2019, which claimspriority under 35 U.S.C. 119(a) to Patent Application No.10-2018-0031895, filed in the Republic of Korea on Mar. 20, 2018, all ofthese applications are hereby expressly incorporated by reference intothe present application.

TECHNICAL FIELD

Embodiments relate to a camera module and an optical device includingthe same.

BACKGROUND ART

Technology of a voice coil motor (VCM), which is used in conventionalgeneral camera modules, is difficult to apply to a micro-scale cameramodule intended to exhibit low power consumption, and study relatedthereto has been actively conducted.

In the case of a camera module configured to be mounted in a smallelectronic product, such as a smartphone, the camera module mayfrequently receive shocks when in use, and may undergo fine shaking dueto, for example, user hand tremor while capturing an image. Inconsideration of this fact, technology for additionally installing adevice for inhibiting transfer of hand tremor to a camera module hasrecently been developed.

DISCLOSURE Technical Problem

Embodiments provide a camera module and an optical device capable ofimproving optical performance, securing reliability of wire bondingbetween a printed circuit board and an image sensor, and increasingbonding force between a stiffener and the image sensor.

Technical Solution

A camera module according to an embodiment may include a lens barrel, aholder, a filter disposed in the holder, a printed circuit board havingtherein an opening, a stiffener including a first region correspondingto the opening and a second region in which the printed circuit board isdisposed, and an image sensor disposed in the first region of thestiffener. The first region of the stiffener may include a protrudingportion protruding further than the second region of the stiffener, andthe image sensor may be disposed on the upper surface of the protrudingportion.

The height from the lower surface of the stiffener to the upper surfaceof the protruding portion may be less than the height to the uppersurface of the printed circuit board disposed on the stiffener.

The protruding portion may include a plurality of protrusions spacedapart from each other. The camera module may further include an adhesivemember disposed in the space between the upper surfaces of the pluralityof protrusions and the lower surface of the image sensor and in thespace between the plurality of protrusions.

The thickness of the image sensor may be less than the thickness of theprinted circuit board.

The camera module may further include a first adhesive member disposedbetween the second region of the stiffener and the lower surface of theprinted circuit board. The first adhesive member may include therein anopening corresponding to the opening in the printed circuit board.

In addition, the camera module may further include a second adhesivemember disposed between the upper surface of the protruding portion andthe lower surface of the image sensor. The second adhesive member may belocated at a higher position than the first adhesive member.

The printed circuit board may include a first terminal, and the imagesensor may include a second terminal. The camera module may furtherinclude a wire connecting the first terminal to the second terminal.

The ratio of the first height from the upper surface of the secondregion of the stiffener to the upper surface of the protruding portionto the second height from the lower surface of the stiffener to theupper surface of the second region of the stiffener may be 1:0.67 to1:2.1.

A camera module according to another embodiment may include a lensbarrel, a holder, a filter disposed in the holder, a printed circuitboard having therein an opening, a stiffener including a first regioncorresponding to the opening and a second region in which the printedcircuit board is disposed, and an image sensor disposed in the firstregion of the stiffener. The first region of the stiffener may include acavity recessed further than the second region of the stiffener, and theimage sensor may be disposed on the bottom surface of the cavity.

A camera module according to still another embodiment may include a lensbarrel, a holder, a filter disposed in the holder, a printed circuitboard having therein an opening, a stiffener including a first regioncorresponding to the opening and a second region in which the printedcircuit board is disposed, an image sensor disposed in the first regionof the stiffener, and an adhesive member including a first adhesivemember disposed between the first region of the stiffener and the imagesensor and a second adhesive member disposed between the second regionof the stiffener and the printed circuit board. The first adhesivemember and the second adhesive member may be connected to each other.

Advantageous Effects

Embodiments are capable of improving the optical performance of a cameramodule, securing reliability of wire bonding between a printed circuitboard and an image sensor, and increasing bonding force between astiffener and the image sensor.

DESCRIPTION OF DRAWINGS

FIG. 1 is an exploded perspective view of a camera module according toan embodiment.

FIG. 2 is a cross-sectional view of an embodiment of the camera moduleof FIG. 1 .

FIG. 3 is an enlarged view of the portion indicated by the dotted linein FIG. 2 .

FIG. 4A is a perspective view of a stiffener according to anotherembodiment.

FIG. 4B is a perspective view of a stiffener according to still anotherembodiment.

FIG. 5 shows the stiffener, the image sensor, and the printed circuitboard of FIG. 4A.

FIG. 6 shows an image sensor and a printed circuit board disposed on astiffener according to still another embodiment.

FIGS. 7A to 7E show a method of forming the stiffener of FIG. 6 .

FIG. 8 is an exploded perspective view of a camera module according toanother embodiment.

FIG. 9 is a cross-sectional view of the stiffener, the image sensor, andthe printed circuit board of FIG. 8 .

FIGS. 10A to 10D show a process of coupling the stiffener, the imagesensor, the printed circuit board, and the adhesive member shown in FIG.9 .

FIG. 11 shows wire bonding between a printed circuit board and an imagesensor when a region in which an adhesive is not charged is present.

FIG. 12 shows simulation results associated with a height differencecaused by warpage of the printed circuit board shown in FIG. 11 , whichoccurs due to force applied thereto during wire bonding, and a heightdifference caused by warpage of the printed circuit board of FIG. 9 ,which occurs due to force applied thereto during wire bonding.

FIG. 13 is a cross-sectional view of other embodiments of the stiffener,the image sensor, and the printed circuit board of FIG. 8 .

FIGS. 14A and 14B show a process of coupling the stiffener, the imagesensor, the printed circuit board, and the adhesive member shown in FIG.13 .

FIG. 15 is a perspective view of a portable terminal according to anembodiment.

FIG. 16 is a configuration diagram of the portable terminal shown inFIG. 14 .

BEST MODE

Hereinafter, embodiments of the present disclosure, which may concretelyrealize the objects described above, will be described with reference tothe accompanying drawings.

In the following description of the embodiments, it will be understoodthat, when each element is referred to as being ″on″ or ″under″ anotherelement, it can be directly on or under the other element, or can beindirectly formed such that one or more intervening elements are alsopresent. In addition, when an element is referred to as being ″on orunder″, ″under the element″ as well as ″on the element″ may be includedbased on the element.

In addition, the relational terms ″first″, ″second″, ″on/upperpart/above″, and ″under/lower part/below″ are used herein only todistinguish between one subject or element and another subject orelement without necessarily requiring or involving any physical orlogical relationship or sequence between such subjects or elements.Wherever possible, the same reference numerals will be used throughoutthe drawings to refer to the same parts.

Additionally, the terms ″comprises″, ″includes″, and ″has″ describedherein should be interpreted not to exclude other elements but tofurther include such other elements, since the corresponding elementsmay be inherent unless mentioned otherwise. In addition, the term″corresponding to″ herein may encompass at least one of the meanings of″facing″ and ″overlapping″.

Hereinafter, a camera module and an optical device including the sameaccording to embodiments will be described with reference to theaccompanying drawings. For convenience of description, a camera moduleaccording to the embodiments will be described using the Cartesiancoordinate system (x, y, z), but the embodiments are not limitedthereto, and may be described using other coordinate systems. In therespective drawings, the x-axis and the y-axis may be directionsperpendicular to the z-axis, which is an optical-axis (OA) direction,the z-axis direction, which is the optical-axis (OA) direction, may bereferred to as a ‘first direction’, the x-axis direction may be referredto as a ‘second direction’, and the y-axis direction may be referred toas a ′third direction′.

A ′hand tremor compensation function′ applied to a small camera moduleof a mobile device such as a smartphone or a tablet PC may be a functionof moving a lens in a direction perpendicular to the optical-axisdirection or tilting the lens with respect to the optical axis so as tocancel vibration (or motion) caused by user hand tremor.

In addition, an ′autofocus function′ may be a function of automaticallyfocusing on an object by moving the lens in the optical-axis directionaccording to the distance to the object so that an image sensor obtainsa clear image of the object.

FIG. 1 is an exploded perspective view of a camera module 200 accordingto an embodiment, FIG. 2 is a cross-sectional view of an embodiment ofthe camera module 200 of FIG. 1 , and FIG. 3 is an enlarged view of theportion indicated by the dotted line 15 in FIG. 2 .

Referring to FIGS. 1 to 3 , the camera module 200 may include a lens ora lens barrel 400, a lens-moving apparatus 100, a filter 610, a holder600, a printed circuit board 800, a stiffener 900, and an image sensor810. Here, the ″camera module″ may be referred to as an ″image capturedevice″ or a ″photographing device″, and the holder 600 may be referredto as a sensor base.

In addition, the camera module 300 may further include a blocking member1500 disposed on the filter 610.

In addition, the camera module 300 may further include an adhesivemember 612.

In addition, the camera module 300 may further include a motion sensor820, a controller 830, and a connector 840.

The lens or the lens barrel 400 may be mounted in a bobbin 110 of thelens-moving apparatus 100.

The lens-moving apparatus 100 may move the lens or the lens barrel 400.

The camera module 200 may be any one of an autofocus (AF) camera moduleand an optical image stabilizer (OIS) camera module. The AF cameramodule is a camera module configured to perform only an autofocusfunction, and the OIS camera module is a camera module configured toperform an autofocus function and an optical image stabilizer (OIS)function.

For example, the lens-moving apparatus 100 may be an AF lens-movingapparatus or an OIS lens-moving apparatus, and the meanings of ″AF″ and″OIS″ may be the same as those of the AF camera module and the OIScamera module.

For example, the lens-moving apparatus 100 of the camera module 200 maybe an OIS lens-moving apparatus.

The lens-moving apparatus 100 may include a housing 140, a bobbin 110disposed in the housing 140 to allow the lens or the lens barrel 400 tobe mounted thereto, a first coil 120 disposed at the bobbin 110, amagnet 130 disposed in the housing 140 so as to face the first coil 120,at least one upper elastic member (not shown) coupled to the upperportion of the bobbin 110 and the upper portion of the housing 140, atleast one lower elastic member (not shown) coupled to the lower portionof the bobbin 110 and the lower portion of the housing 140, a secondcoil 230 disposed under the bobbin 110 (and/or the housing 140), aprinted circuit board 250 disposed under the second coil 230, and a base210 disposed under the printed circuit board 250.

In addition, the lens-moving apparatus 100 may further include a covermember 300 coupled to the base 210 to provide space for accommodatingthe components of the lens-moving apparatus 100 together with the base210.

In addition, the lens-moving apparatus 100 may further include a supportmember (not shown) electrically connecting the printed circuit board 250to the upper elastic member and supporting the housing 140 with respectto the base 210. Each of the first coil 120 and the second coil 230 maybe electrically connected to the printed circuit board 250, and mayreceive a driving signal (driving current) from the printed circuitboard 250.

For example, the upper elastic member may include a plurality of uppersprings, the support member may include support members connected to theupper springs, and the first coil 120 may be electrically connected tothe printed circuit board 250 via the upper springs and the supportmember. The printed circuit board 250 may include a plurality ofterminals, and some of the plurality of terminals may be electricallyconnected to the first coil 120 and/or the second coil 230.

The bobbin 110 and the lens or the lens barrel 400 coupled thereto maybe moved in the optical-axis direction due to the electromagnetic forcegenerated by interaction between the first coil 120 and the magnet 130,and accordingly, the displacement of the bobbin 110 in the optical-axisdirection may be controlled, whereby an AF operation may be implemented.

In addition, the housing 140 may be moved in a direction perpendicularto the optical axis due to the electromagnetic force generated byinteraction between the second coil 230 and the magnet 130, andaccordingly, a hand tremor compensation or OIS operation may beimplemented.

In addition, in order to implement an AF feedback operation, thelens-moving apparatus 100 of the camera module 200 may further include asensing magnet (not shown) disposed at the bobbin 110 and an AF positionsensor (e.g. a hall sensor) (not shown) disposed in the housing 140. Inaddition, the lens-moving apparatus 100 may further include a printedcircuit board (not shown) disposed in the housing and/or on the base toallow the AF position sensor to be disposed or mounted thereon. Inanother embodiment, the AF position sensor may be disposed at thebobbin, and the sensing magnet may be disposed in the housing. Inaddition, the lens-moving apparatus 100 may further include a balancingmagnet disposed at the bobbin 110 so as to correspond to the sensingmagnet.

The AF position sensor may output an output signal according to theresult of detection of the magnitude of the magnetic field of thesensing magnet upon movement of the bobbin 100. The AF position sensormay be electrically connected to the printed circuit board 250 via theupper elastic member (or the lower elastic member) and/or the supportmember. The printed circuit board 250 may provide a driving signal tothe AF position sensor, and the output of the AF position sensor may betransmitted to the printed circuit board 250.

In another embodiment, the lens-moving apparatus 100 may be an AFlens-moving apparatus, and the AF lens-moving apparatus may include ahousing, a bobbin disposed in the housing, a coil disposed at thebobbin, a magnet disposed in the housing, at least one elastic membercoupled to the bobbin and the housing, and a base disposed under thebobbin (and/or the housing). For example, the elastic member may includethe upper elastic member and the lower elastic member described above.

A driving signal (e.g. driving current) may be provided to the coil, andthe bobbin may be moved in the optical-axis direction due to theelectromagnetic force generated by interaction between the coil and themagnet. In another embodiment, the coil may be disposed in the housing,and the magnet may be disposed at the bobbin.

In addition, in order to implement an AF feedback operation, the AFlens-moving apparatus may further include a sensing magnet disposed atthe bobbin, an AF position sensor (e.g. a hall sensor) disposed in thehousing, and a printed circuit board disposed or mounted in the housingand/or on the base to allow the AF position sensor to be mountedthereon. In another embodiment, the AF position sensor may be disposedat the bobbin, and the sensing magnet may be disposed in the housing.

The camera module according to another embodiment may include, insteadof the lens-moving apparatus 100 of FIG. 1 , a housing coupled to thelens or the lens barrel 400 to fix the lens or the lens barrel 400, andthe housing may be coupled or attached to the upper surface of theholder 600. The housing attached or fixed to the holder 600 may not bemoved, and the position of the housing may be fixed in the state inwhich the housing is attached to the holder 600.

The printed circuit board may be electrically connected to the coil andthe AF position sensor, a driving signal may be provided to each of thecoil and the AF position sensor through the printed circuit board, andthe output of the AF position sensor may be transmitted to the printedcircuit board.

The holder 600 may be disposed under the base 210 of the lens-movingapparatus 100.

The filter 610 may be mounted to the holder 600, and the holder 600 mayinclude a seating portion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of thelens-moving apparatus 100 to the holder 600. For example, the adhesivemember 612 may be disposed between the lower surface of the base 210 andthe upper surface of the holder 600, and may bond these two componentsto each other.

The adhesive member 612 may serve not only to bond components, asdescribed above, but also to prevent foreign substances from enteringthe lens-moving apparatus 100. For example, the adhesive member 612 maybe an epoxy, a thermosetting adhesive, or an ultraviolet curableadhesive.

The filter 610 may be disposed in the seating portion 500 of the holder600.

The seating portion 500 of the holder 600 may include a protrudingportion 500 a protruding from the upper surface of the holder 600,without being limited thereto. In another embodiment, the seatingportion may be a recess, a cavity, or a hole, which is concavely formedin the upper surface of the holder 600.

The protruding portion 500 a of the seating portion 500 may serve toprevent the lower end of the lens or the lens barrel 400 from cominginto contact with or colliding with the filter 610 (and/or the blockingmember 1500).

The protruding portion 500 a may be formed to protrude along the sidesurface of the filter 610 in the optical-axis direction. For example,the protruding portion 500 a may be disposed around the side surface ofthe filter 610 so as to surround the side surface of the filter 610.

The inner surface of the protruding portion 500 a may be provided so asto face the side surface of the filter 610, and these two components maybe spaced apart from each other. The reason for this is to secureprocessing tolerance to facilitate mounting of the filter 610 in theseating portion 500 of the holder 600.

In addition, the upper surface of the protruding portion 500 a may bepositioned above the upper surface 610 of the filter 610 in theoptical-axis direction. The reason for this is to prevent the lower endof the lens or the lens barrel 400 from directly colliding with thefilter 610 when the lens or the lens barrel 400 is mounted in thelens-moving apparatus 100 and moves in the optical-axis direction ormoves toward the filter 610 due to an external impact.

The shape of the protruding portion 500 a viewed from above may matchthe shape of the filter 610, without being limited thereto. In anotherembodiment, the shape of the protruding portion 500 a may be similar toor different from the shape of the filter 610.

The holder 600 may have an opening 501 formed in the region thereof inwhich the filter 610 is mounted or disposed so that light passingthrough the filter 610 enters the image sensor 810.

For example, the opening 501 may penetrate the holder 600 in theoptical-axis direction, and may be referred to as a ″through-hole″.

For example, the opening 501 may penetrate the center of the holder 600and may be provided in the seating portion 500, and the area of theopening 501 may be smaller than the area of the filter 610.

The holder 600 may be disposed on the printed circuit board 800, and mayaccommodate the filter 610 therein. The holder 600 may support thelens-moving apparatus 100 positioned thereon. The lower surface of thebase 210 of the lens-moving apparatus 100 may be disposed on the uppersurface of the holder 600.

For example, the lower surface of the base 210 of the lens-movingapparatus 100 may be in contact with the upper surface of the holder600, and may be supported by the upper surface of the holder 600.

For example, the filter 610 may be disposed in the seating portion 500of the holder 600.

The filter 610 may serve to block light in a specific frequency band,among the light passing through the lens barrel 400, from entering theimage sensor 810.

For example, the filter 610 may be an infrared cut-off filter, withoutbeing limited thereto. For example, the filter 610 may be disposedparallel to the x-y plane, which is perpendicular to the optical axisOA.

The filter 610 may be attached to the seating portion 500 of the holder600 using an adhesive member (not shown) such as UV epoxy.

The printed circuit board 800 may be disposed under the holder 600, andthe holder 600 may be disposed on the upper surface of the printedcircuit board 800.

The holder 600 may be attached or fixed to the upper surface of theprinted circuit board 800 using an adhesive member such as an epoxy, athermosetting adhesive, or an ultraviolet curable adhesive. In thiscase, the adhesive member may be disposed between the lower surface ofthe holder 600 and the upper surface of the printed circuit board 800.

The printed circuit board 800 may have therein an opening 801corresponding to the opening 501 in the holder 600. The opening 801 inthe printed circuit board 800 may be a through-hole penetrating theprinted circuit board 800 in the optical-axis direction.

The image sensor 810 may be disposed in the opening 801 in the printedcircuit board 800.

The stiffener 900 may be disposed under the printed circuit board 800,and may include a protruding portion 901 formed corresponding to theopening 801 in the printed circuit board 800 to allow the image sensor810 to be mounted thereto.

The protruding portion 901 may protrude from the region of the uppersurface of the stiffener 900 in the optical-axis direction. The imagesensor 810 may be disposed on the upper surface of the protrudingportion 901, and may be exposed through the opening 801 in the printedcircuit board 800.

The image sensor 810 disposed on the upper surface of the protrudingportion 901 of the stiffener 900 may be electrically connected to theprinted circuit board 800 via a wire 21. For example, the wire 21 mayconnect a terminal 813 of the image sensor 810 and a terminal 1830 ofthe printed circuit board 800 to each other.

The stiffener 900 is a plate-type member having a predeterminedthickness and hardness, and may stably support the image sensor 810 andprevent damage to the image sensor due to an external impact or contact.

In addition, the stiffener 900 may improve a heat dissipation effect ofdissipating the heat generated from the image sensor to the outside.

For example, the stiffener 900 may be formed of a metal material havinghigh thermal conductivity, such as SUS or aluminum, without beinglimited thereto. In another embodiment, the stiffener 900 may be formedof glass epoxy, plastic, or synthetic resin.

In addition, the stiffener 900 may be electrically connected to a groundterminal of the printed circuit board 800, and thus may serve as aground for protecting the camera module from electrostatic discharge(ESD).

The image sensor 810 may be a part on which the light that has passedthrough the filter 610 is incident and in which an image included in thelight is formed.

The printed circuit board 800 may be provided with various circuits,elements, and controllers in order to convert an image formed by theimage sensor 810 into an electrical signal and to transmit theelectrical signal to an external device. A circuit pattern, which iselectrically connected to the image sensor and various elements, may beformed on the printed circuit board 800.

The holder 600 may be referred to as a first holder, and the printedcircuit board 800 may be referred to as a second holder.

The image sensor 810 may receive an image included in the lightintroduced through the lens-moving apparatus 100, and may convert thereceived image into an electrical signal.

The filter 610 and the image sensor 810 may be disposed so as to bespaced apart from each other and to face each other in the optical-axis(OA) direction or the first direction.

In addition, the protruding portion 500 a of the holder 600 may bedisposed so as to face the filter 610 in the optical-axis direction.

The blocking member 1500 may be disposed on the upper surface of thefilter 610. The blocking member 1500 may be referred to as a ″maskingpart″.

For example, the blocking member 1500 may be disposed on the edgeportion of the upper surface of the filter 610, and may serve to blockat least a portion of the light traveling toward the edge portion of thefilter 610 through the lens or the lens barrel 400 from passing throughthe filter 610. For example, the blocking member 1500 may be coupled orattached to the upper surface of the filter 1610.

For example, the filter 610 may be formed in a rectangular shape whenviewed in the optical-axis direction, and the blocking member 1500 maybe formed to be symmetrical with respect to the filter 610 along eachside of the upper surface of the filter 610.

In this case, the blocking member 1500 may be formed to have apredetermined width on each side of the upper surface of the filter1610.

The blocking member 1500 may be formed of an opaque material. Forexample, the blocking member 1500 may be an opaque and adhesive materialthat is applied to the filter 610, or may be provided in the form of afilm that is attached to the filter 610.

The filter 610 and the image sensor 810 may be disposed so as to faceeach other in the optical-axis direction, and at least a portion of theblocking member 1500 may overlap the terminal 1830 and/or the wire 21disposed on the printed circuit board 800 in the optical-axis direction.

The wire 21 and the terminal 1830 may be formed of a conductive materialsuch as gold, silver, copper, or a copper alloy, and this conductivematerial may have a property of reflecting light. The light that haspassed through the filter 610 may be reflected by the terminal 1830 ofthe printed circuit board 800 and the wire 21, and an instantaneousflash, i.e. a flare phenomenon, may occur due to this reflected light.Such a flare phenomenon may distort the image formed by the image sensor810 or may deteriorate the quality of the image.

Since the blocking member 1500 is disposed such that at least a portionthereof overlaps the terminal 1830 and/or the wire 21 in theoptical-axis direction, the blocking member 1500 may block the lighttraveling toward the terminal 1830 of the printed circuit board 800and/or the wire 21, among the light that has passed through the lens orthe lens barrel 400, thereby preventing the occurrence of theaforementioned flare phenomenon, thus preventing distortion of an imageformed by the image sensor 810 or deterioration in the quality of animage.

The motion sensor 820 may be mounted or disposed on the printed circuitboard 800, and may be electrically connected to the controller 830 via acircuit pattern provided on the printed circuit board 800.

The motion sensor 820 outputs rotating angular speed informationaccording to the motion of the camera module 200. The motion sensor 820may be implemented as a 2- or 3-axis gyro sensor or an angular speedsensor.

The controller 830 is mounted or disposed on the printed circuit board800.

The printed circuit board 800 may be electrically connected to thelens-moving apparatus 100. For example, the printed circuit board 800may be electrically connected to the printed circuit board 250 of thelens-moving apparatus 100.

For example, a driving signal may be provided to each of the first coil120 and the second coil 230 of the lens-moving apparatus 100 through theprinted circuit board 800, and a driving signal may be provided to theAF position sensor (or the OIS position sensor). Further, the output ofthe AF position sensor (or the OIS position sensor) may be transmittedto the printed circuit board 800.

The connector 840 may be electrically connected to the printed circuitboard 800, and may include a port to be electrically connected to anexternal device.

An adhesive member 1750 may be disposed between the lower surface of theimage sensor 810 and the upper surface 901 a of the protruding portion901, and the image sensor 810 may be attached or fixed to the uppersurface 901 a of the protruding portion 901 using the adhesive member1750. The adhesive member 1750 may be an epoxy, a thermosettingadhesive, an ultraviolet curable adhesive, or an adhesive film, withoutbeing limited thereto.

In addition, an adhesive member 1700 may be disposed between the lowersurface of the printed circuit board 800 and the upper surface 900 a ofthe second region S2 of the stiffener 900, and the printed circuit board800 may be attached or fixed to the stiffener 900 using the adhesivemember 1700. For example, the adhesive member 1700 may be an epoxy, athermosetting adhesive, an ultraviolet curable adhesive, or an adhesivefilm, without being limited thereto.

The area of the upper surface of the protruding portion 901 may be equalto or greater than the area of the lower surface of the image sensor810. For example, the edge of the lower surface of the image sensor 810may be in contact with the edge of the upper surface 901 a of theprotruding portion 901, without being limited thereto. In anotherembodiment, the edge of the lower surface of the image sensor 810 may bespaced apart from the edge of the upper surface 901 a of the protrudingportion 901.

For example, the ratio (H1:H2) of the first height H1 from the uppersurface 900 a of the second region S2 of the stiffener 900 to the uppersurface 901 a of the protruding portion 901 to the second height H2 fromthe lower surface 900 b of the stiffener 900 to the upper surface 900 aof the second region S2 of the stiffener 900 may be 1:0.67 to 1:2.1.

When the value (H2/H1) obtained by dividing the second height by thefirst height is less than 0.67, the stiffener 900 is liable to be bentor deformed to such an extent that it is not capable of supporting theprinted circuit board 800.

Further, when the value (H2/H1) obtained by dividing the second heightby the first height is greater than 2.1, the height by which theprotruding portion 901 protrudes is too small to improve the flatness ofthe stiffener 900, and the effect of reducing the height differencebetween the upper surface of the image sensor 810 and the upper surfaceof the printed circuit board 800 in the optical-axis direction isreduced, and thus the reliability of wire bonding between these twocomponents may not be secured.

For example, H1 may be 80 [µm] to 150 [µm], and H2 may be 100 [µm] to170 [µm].

The height from the lower surface 900 b of the stiffener 900 to theupper surface 901 a of the protruding portion 901 of the stiffener 900may be less than the height to the upper surface of the printed circuitboard 800 disposed on the stiffener 900.

For example, the stiffener 900 may include a first region S1 and asecond region S2. The first region S1 may be the region to which theimage sensor 810 is attached, and the second region S2 may be the regionto which the printed circuit board 800 is attached.

The first region S1 of the stiffener 900 may include a protrudingportion 901 protruding on the basis of the second region S2 in thedirection from the lower surface of the stiffener toward the uppersurface of the stiffener, and the image sensor 810 may be disposed onthe upper surface of the protruding portion 901.

For example, the first region S1 of the stiffener 900 may include aprotruding portion 901 that protrudes further than the second region S2of the stiffener 900.

The thickness T1 of the first region S1 of the stiffener 900 is greaterthan the thickness T2 of the second region S2 of the stiffener 900 (T1 >T2).

Since T1 > T2, warpage of the upper surface 901 a of the protrudingportion 901 of the stiffener 900 may be suppressed, and the flatness ofthe upper surface 901 a of the protruding portion 901 may be improved.Accordingly, in the embodiment, the reliability of the image sensor 810disposed on the upper surface of the protruding portion 901 may beimproved, and the optical performance of the camera module may beimproved.

Since the second region S2 of the stiffener 900 has a constantthickness, it may not affect the overall height of the camera moduleaccording to the embodiment.

Since the image sensor 910 is disposed on the upper surface 901 a of theprotruding portion 901, the height difference between the upper surfaceof the printed circuit board 800 and the upper surface of the imagesensor 810 may be reduced, with the result that the length of the wirebetween the printed circuit board 800 and the image sensor 810 may bereduced, and thus the reliability of wire bonding may be improved.

The spacing distance D1 between the side surface of the protrudingportion 901 of the stiffener 900 and the side surface of the opening inthe printed circuit board may be 100 [µm] to 250 [µm].

When D1 is less than 100 [µm], the attachment tolerance within which theprinted circuit board 800 is attached to the stiffener 900 may bereduced, which may cause misalignment between the opening 801 in theprinted circuit board 800 and the protruding portion 901 of thestiffener 900 and damage to the printed circuit board 800 due to acollision between the printed circuit board 800 and the protrudingportion 901.

When D1 is greater than 250 [µm], the spacing distance between the imagesensor and the printed circuit board may be excessive, and thus thereliability of wire bonding may be deteriorated.

FIG. 4A is a perspective view of a stiffener 900-1 according to anotherembodiment, and FIG. 5 shows the stiffener 900-1, the image sensor 810,and the printed circuit board 800 of FIG. 4A.

Referring to FIGS. 4A and 5 , the stiffener 900-1 may include aprotruding portion 901A disposed in the first region S1 to allow theimage sensor to be disposed thereon or attached thereto.

The protruding portion 901A may include a plurality of protrusions 901-1to 901-n (n is a natural number, and n > 1).

The plurality of protrusions 901-1 to 901-n may be spaced apart fromeach other, and each of the plurality of protrusions 901-1 to 901-n mayprotrude in the optical-axis direction on the basis of the upper surface900 a of the second region of the stiffener 901-1.

An adhesive member 1750 a may be disposed between the upper surfaces ofthe plurality of protrusions 901-1 to 901-n and the lower surface of theimage sensor 810.

In addition, the adhesive member 1750 a may be disposed between theplurality of protrusions 901-1 to 901-n, or may be charged in the spacebetween the plurality of protrusions 901-1 to 901-n.

The description made with reference to FIG. 3 may apply to H1 and H2 ofFIG. 5 .

Each of the plurality of protrusions 901-1 to 901-n may have a lineshape or a stripe shape, without being limited thereto. In anotherembodiment, it may be formed in the shape of a net, a plurality of dots,or a plurality of islands.

FIG. 4B is a perspective view of a stiffener 900-2 according to stillanother embodiment.

Referring to FIG. 4B, the stiffener 900-2 may include a protrudingportion 902, which includes a plurality of protrusions 902-1 to 902-m (mis a natural number, and m > 1) disposed in the first region S1.

Each of the plurality of protrusions 902-1 to 902-m may protrude fromthe upper surface of the stiffener 901-2 in the optical-axis direction.

Each of the plurality of protrusions 901-2 to 902-m may have a lineshape or a stripe shape.

One ends of the plurality of protrusions 901-2 to 902-m may be connectedto each other. In addition, the opposite ends of the plurality ofprotrusions 902-1 to 902-m may be connected to each other.

As described with reference to FIG. 4A, an adhesive member may becharged in the space between the upper surfaces of the plurality ofprotrusions 902-1 to 902-m and the lower surface of the image sensor 810and the space between the plurality of protrusions 902-1 to 902-m.

The stiffener and the image sensor are fixed to each other using anadhesive member. Depending on the material of the stiffener, the bondingforce between the stiffener and the image sensor may be reduced, whichmay cause a problem of reliability associated with bonding.

In addition, in general, when the stiffener and the image sensor arebonded to each other, pressure is applied to an adhesive. Due to thispressure, the adhesive may overflow out of the bonding surface betweenthe stiffener and the image sensor, and thus the bonding force betweenthese two components may be reduced.

In addition, in order to prevent overflow of the adhesive, if the areaor size of the adhesive is made smaller than the size (or the area) ofthe lower surface of the image sensor so that the adhesive is placedinside the edge of the lower surface of the image sensor, the flatnessof the image sensor is deteriorated during wire bonding, and thusreliability of wire bonding may be deteriorated.

In the embodiments shown in FIGS. 4A to 5 , an uneven portion having apredetermined size is formed on the upper surface of the protrudingportion 901A, thereby increasing the bonding area between the adhesivemember 1750 a and the protruding portion 901A or 902 of the stiffener900-1 or 900-2, thus increasing bonding force between the stiffener900-1 or 900-2 and the image sensor 810.

Here, the convex portions of the uneven portion may be theabove-described protrusions 901-1 to 901-n or 902-1 to 902-m, and theconcave portions of the uneven portion may be the spaces between theprotrusions 901-1 to 901-n or 902-1 to 902-m.

In addition, even when pressure is applied to the adhesive member 1750 ato bond the image sensor 810 and the protruding portion 901A or 902 toeach other, the convex portions of the uneven portion or the protrusions901-1 to 901-n or 902-1 to 902-m may suppress overflow of the adhesive,thereby preventing deterioration in the bonding force and preventing theimage sensor from being contaminated by the adhesive.

In addition, since overflow of the adhesive is suppressed as describedabove, the edge of the adhesive member 1750 a may extend to the edge ofthe lower surface of the image sensor 810, thereby preventingdeterioration in the reliability of wire bonding when wire bonding isperformed between the image sensor and the printed circuit board.

FIG. 6 shows an image sensor 810 and a printed circuit board 800disposed on a stiffener 900-3 according to still another embodiment.

Referring to FIG. 6 , the stiffener 900-3 may include a cavity 905 or arecess formed in a first region S1. The cavity 905 may have a structurethat is recessed from the upper surface of the stiffener 900-3.

For example, the first region S1 of the stiffener 900-3 may include acavity 905 that is depressed further than a second region S2 of thestiffener 900-3.

The image sensor 810 may be disposed in the cavity 905, and may beattached or fixed to a bottom surface 905 a of the cavity 905 using anadhesive member 1750.

The printed circuit board 800 may be disposed in the second region S2 ofthe stiffener 900-3, and the lower surface of the printed circuit board800 may be attached or fixed to the second region S2 of the stiffener900-3 using the adhesive member 1700.

In order to increase the bonding force between the stiffener 900-3 andthe image sensor 810, the bottom surface 905 a of the cavity 905 of thestiffener 900-3 of FIG. 6 may be provided with an uneven portion orprotrusions (not shown), which are the same as or similar to thosedescribed with reference to FIGS. 4A and 4B.

The image sensor 810 and the printed circuit board 800 may havedifferent thicknesses. That is, the thickness of each of the imagesensor and the printed circuit board, which are mounted in the cameramodule, is not uniform, but may vary according to customers’ requests,design specifications, or the size of the camera module. Upon wirebonding between the image sensor and the printed circuit board havingvarious thicknesses, if the height difference between the terminal ofthe image sensor and the terminal of the printed circuit board in theoptical-axis direction is large, the reliability of wire bonding may bedeteriorated.

The depth DT from the upper surface 900 a of the stiffener 900-3 to thebottom surface 905 a of the cavity 905 may be less than or equal to thethickness T4 of the image sensor (DT ≤ T4). The reason for this is toprevent deterioration in the reliability of wire bonding between theimage sensor 810 and the printed circuit board 800 due to an increase inthe height difference between the upper surface of the image sensor 810and the upper surface of the printed circuit board 800 in theoptical-axis direction.

However, in another embodiment, DT may be greater than T4 (DT > T4)depending on the thickness of the image sensor 810 and the thickness ofthe printed circuit board 800.

In the embodiment, in order to prevent deterioration in the reliabilityof wire bonding between the printed circuit board 800 and the imagesensor 810, which have different thicknesses from each other, the cameramodule according to the embodiment may include the stiffener 900, 900-1or 900-2 of FIGS. 3, 4A or 4B or the stiffener 900-3 of FIG. 6 .

For example, when the thickness T4 of the image sensor 810 is greaterthan the thickness T3 of the printed circuit board 800 (T4 > T3), theembodiment includes the stiffener 900-3 of FIG. 6 so as to reduce theheight difference DP between these two components in the optical-axisdirection, thereby preventing deterioration in the reliability of wirebonding.

On the other hand, as shown in FIG. 3 , when the thickness T4 of theimage sensor 810 is less than the thickness T3 of the printed circuitboard 800 (T4 < T3), the embodiment may include the stiffener 900, 900-1or 900-2 of FIGS. 3, 4A or 4B so as to reduce the height differencebetween these two components in the optical-axis direction, therebypreventing deterioration in the reliability of wire bonding.

FIGS. 7A to 7D show a method of forming the stiffener 900-3 of FIG. 6 .

Referring to FIG. 7A, a reinforced plate member 90 for forming thestiffener is prepared.

As shown in FIG. 7B, a first mask 92 or a second mask 92 a is formed onthe reinforced plate member 90. For example, the first mask 92 may beformed on the first region S1, in which the image sensor 810 is to bedisposed, and the second mask 92 a may be formed on the second regionS2, in which the printed circuit board 800 is to be disposed.

Subsequently, the reinforced plate member 90 is etched using the firstmask 92 or the second mask 92 a as an etching mask to form the stiffener900 of FIG. 3 or the stiffener 900-3 of FIG. 6 . The stiffener 900-1 or900-2 of FIGS. 4A or 4B may be formed depending on the shape of thepattern of the first mask 92 and the second mask 92 a.

After the stiffener 900 or 900-3 is formed, the first mask 92 or thesecond mask 92 a is removed.

Subsequently, as shown in FIG. 7C, an adhesive member 1700 is attachedto the lower surface of the printed circuit board 800. For example, theadhesive member 1700 may be attached to the entire area of the lowersurface of the printed circuit board 800.

For example, the ratio of the area of the lower surface of the printedcircuit board 800 to the area of the adhesive member 1700 attached tothe lower surface of the printed circuit board 800 may be 1:1.

In FIG. 7C, the thickness of the printed circuit board 800 is expresseddifferently according to the embodiment 900 or 900-3 of the stiffener.

Subsequently, as shown in FIG. 7D, an opening 89 is formed so as topenetrate the printed circuit board 800 and the adhesive member 1700 byselectively etching the printed circuit board 800 and the adhesivemember 1700 using a mask (not shown) on the printed circuit board 800 towhich the adhesive member 1700 has been attached.

Subsequently, as shown in FIG. 7E, the adhesive member 1700 fixed to theprinted circuit board 800 of FIG. 7D is attached to the second region ofthe stiffener 900 or 900-3.

As shown in FIGS. 7C and 7D, since the opening 89 is formed throughetching after the adhesive member 1700 is attached to the printedcircuit board 800, the edge of the adhesive member 1700 may extend tothe opening 801 in the printed circuit board 800, thereby preventingdeterioration in the reliability of wire bonding when wire bonding isperformed between the image sensor and the printed circuit board.

In another embodiment, unlike the processing of FIGS. 7C and 7D, anadhesive member may be formed in the second region of the stiffener ofFIG. 7B, and a printed circuit board having therein an opening may beattached to the adhesive member disposed in the second region of thestiffener.

FIG. 8 is an exploded perspective view of a camera module 200-1according to another embodiment, and FIG. 9 is a cross-sectional view ofthe stiffener 900-4, the image sensor 810, and the printed circuit board800 of FIG. 8 . The same reference numerals as those in FIG. 1 denotethe same components, and a description of the same components will beomitted or made briefly.

Referring to FIGS. 8 and 9 , the stiffener 900-4 includes a first regionS1 and a second region S2, and the protruding portion 901 of FIG. 3 orthe cavity 905 is not formed in the first region S1 of the stiffener900-4. For example, the first region S1 of the stiffener 900-4 may be aflat surface.

The printed circuit board 800 is attached to the second region S2 of thestiffener 900-4 using an adhesive member 1700. An opening 89 may beformed so as to penetrate the printed circuit board 800 and the adhesivemember 1700 to expose the first region S1 of the stiffener 900-4.

The printed circuit board 800 may have a structure in which a firstinsulating layer 81-1, a first conductive layer 82-1, a secondinsulating layer 81-2, a second conductive layer 82-2, and a thirdinsulating layer 81-3 are sequentially stacked.

The printed circuit board 800 may include at least one terminal 1830,which is disposed on the third insulating layer 81-3 and is electricallyconnected to at least one of the first conductive layer 82-1 or thesecond conductive layer.

The inner surface 17 a of the adhesive member 1700 may extend to theinner surface 17 b of the opening 801 in the printed circuit board 800.

For example, the inner surface 17 a of the adhesive member 1700 and theinner surface 17 b of the opening 801 in the printed circuit board 800may be positioned in the same plane in the optical-axis direction.

The adhesive member 1750 disposed in the first region S1 may be spacedapart from the adhesive member 1700 disposed in the second region S2.For example, the adhesive member 1750 and the adhesive member 1700 mayhave different thicknesses from each other, or may be formed throughdifferent processes from each other.

The image sensor 810 is disposed on the first region S1 of the stiffener900-4, which is exposed through the opening 801, and is attached to thefirst region S1 using the adhesive member 1750.

The image sensor 810 may include a terminal 813, which is electricallyconnected to the terminal 1830 of the printed circuit board 800 via awire 21.

FIGS. 10A to 10D show a process of coupling the stiffener 900-4, theimage sensor 810, the printed circuit board 800, and the adhesive member1700 shown in FIG. 9 .

Referring to FIGS. 10A and 10B, a printed circuit board 800 havingtherein an opening 801 to expose the image sensor 810 and an adhesivemember 1700 b having a size corresponding to the size of the printedcircuit board 800 are prepared. Here, the opening 801 may be athrough-hole penetrating the printed circuit board 800.

For example, the area of the printed circuit board 800 defined by thehorizontal length and the vertical length thereof may be the same as thearea of the adhesive member 1700 defined by the horizontal length andthe vertical length thereof.

Subsequently, the adhesive member 1700 b is attached to the lowersurface of the printed circuit board 800 having therein the opening 801.A portion of the adhesive member 1700 b attached to the lower surface ofthe printed circuit board 800 may be exposed through the opening 801 inthe printed circuit board 800. For example, the area of the adhesivemember 1700 b exposed through the opening 801 may be the same as thearea of the opening 801.

Subsequently, referring to FIG. 10C, the region 1700 a of the adhesivemember 1700 b that is exposed through the opening 801 is removed throughan etching process using a mask to form an adhesive member 1700 havingtherein an opening, and the mask is removed.

An opening 89 may be formed so as to penetrate the printed circuit board800 and the adhesive member 1700 through the processing of FIG. 10C.

Subsequently, referring to FIG. 10D, the adhesive member 1700 isattached to the stiffener 900-4. The first region S1 of the stiffener900-4 may be exposed through the opening 89.

Subsequently, the image sensor 810 is disposed or mounted in the firstregion S1 of the stiffener 900-4. The image sensor 810 may be attachedto the first region S1 of the stiffener 900-4 using the adhesive member1750. Subsequently, a wire connecting the terminal of the printedcircuit board 800 to the terminal of the image sensor 810 is formedthrough a wire-bonding process.

Since the opening 89 is formed through an etching process after theadhesive member 1700 is bonded to the printed circuit board 800 andsince the printed circuit board 800 and the adhesive member 1700, whichhave therein the opening 89 and are coupled to each other, aresimultaneously attached to the stiffener 900-4, the embodiment iscapable of preventing the generation of an unfilled region between thelower surface of the printed circuit board 800 and the second region S2of the stiffener 900-4, in which the adhesive member 1700 is notcharged.

In general, when the printed circuit board and the stiffener areattached to each other using an adhesive, pressure is applied to theadhesive. Due to this pressure, the adhesive may overflow out of thebonding surface between the stiffener and the printed circuit board,whereby the bonding force between these two components may be reduced,or the image sensor may be contaminated.

In order to prevent overflow of the adhesive and to secure theattachment tolerance of the adhesive, the adhesive is attached to theprinted circuit board so as to be spaced inwards apart from the innersurface of the opening in the printed circuit board by 200 [µm] to 300[µm]. However, in the case in which the adhesive is attached to theprinted circuit board so as to be spaced inwards apart from the innersurface of the opening in the printed circuit board by 200 [µm] to 300[µm], an unfilled region, in which the adhesive is not charged, isgenerated between the printed circuit board and the stiffener, which maycause warpage of the printed circuit board, and when wire bonding isperformed between the warped printed circuit board and the image sensor,the reliability of wire bonding may be deteriorated.

FIG. 11 shows wire bonding between a printed circuit board 32 and animage sensor 33 when a region 12-1 in which an adhesive is not chargedis present.

Referring to FIG. 11 , in the case in which the adhesive 30 is disposedso as to be spaced inwards apart from the inner surface of the openingin the printed circuit board 32 by a predetermined distance (d1 = 200[µm] to 300 [µm]), a region 12-1 in which the adhesive 30 is not chargedmay be formed between the printed circuit board 32 and the stiffener 31,and the printed circuit board 30 may be warped due to the presence ofthe region 12-1 in which the adhesive 30 is not charged.

In the case of forming a wire 35 connecting a terminal 32 a provided ata warped portion of the printed circuit board 30 to a terminal 33 a ofthe image sensor 33 using a wire-bonding apparatus 25, wire bouncing mayoccur, and the reliability of wire bonding may be deteriorated.

FIG. 12 shows simulation results pertaining to a height differencecaused by warpage of the printed circuit board 32 shown in FIG. 11 ,which occurs due to the force applied thereto during wire bonding, andthe height difference caused by warpage of the printed circuit board 800according to the embodiment of FIG. 9 , which occurs due to the forceapplied thereto during wire bonding.

Here, the height difference in FIG. 12 may be the height difference fromone end of the printed circuit board 32 to the opposite end thereof,which is indicated by F1. For example, the height difference in FIG. 12may be the height difference between the highest point of the printedcircuit board and the lowest point thereof. The X-axis represents theforce applied to the printed circuit board 32 or 800 by the wire-bondingapparatus, and the unit of force may be [g·cm/s^2]. The Y-axisrepresents the height difference, and the unit thereof may bemicrometers.

g 1 represents the height difference caused by warpage of the printedcircuit board 32, and g 2 represents the height difference caused bywarpage of the printed circuit board 800.

Referring to FIG. 12 , as the force applied to the printed circuit board32 increases, the height difference g 1 increases, but even when theforce applied to the printed circuit board 800 increases, the heightdifference g 2 may be constant.

According to the simulation results of FIG. 12 , in the embodiment, theprinted circuit board 800 is warped insignificantly during wire bonding,and thus the height difference is constant, thereby securing reliabilityof wire bonding between the printed circuit board 800 and the imagesensor 810.

FIG. 13 is a cross-sectional view of other embodiments of the stiffener900-4, the image sensor 810, and the printed circuit board 800 of FIG. 8. The same reference numerals as those in FIG. 8 denote the samecomponents, and a description of the same components will be omitted ormade briefly.

Referring to FIG. 13 , the printed circuit board 800 and the imagesensor 810 may be attached to the stiffener 900-4 using one adhesivemember 1700 b.

That is, the adhesive member 1700 b may include a first adhesive member1700 b 1 disposed in a first region S1 of the stiffener 900-4 and asecond adhesive member 1700 b 2 disposed in a second region S2 of thestiffener 900-4 and connected to or contiguous with the first adhesivemember 1700 b 1.

For example, the first adhesive member 1700 b 1 may be in contact withthe opening 801 in the printed circuit board 800 along the inner surfaceof the opening 801 in the printed circuit board 800.

For example, the adhesive member 1700 b may cover the entire area of thefirst region S1 of the stiffener 900-4.

For example, the upper surface of the first adhesive member 1700 b 1 andthe upper surface of the second adhesive member 1700 b 2 may bepositioned in the same plane.

FIGS. 14A and 14B show a process of coupling the stiffener 900-4, theimage sensor 810, the printed circuit board 800, and the adhesive member1700 b shown in FIG. 13 .

First, as described with reference to FIGS. 10A and 10B, the adhesivemember 1700 b is attached to the lower surface of the printed circuitboard 800 having therein the opening 801.

Subsequently, as shown in FIGS. 14A and 14B, the adhesive member 1700 bis attached to the upper surface of the stiffener 900-4. For example,the adhesive member 1700 b may cover both the first region S1 and thesecond region S2 of the stiffener 900-4.

For example, the adhesive member 1700 b may include a first adhesivemember 1700b1covering the entire area of the first region S1 of thestiffener 900-4 and a second adhesive member 1700 b 2 covering theentire area of the second region S2 of the stiffener 900-4. The firstadhesive member 1700 b 1 may be exposed through the opening 801 in theprinted circuit board 800.

Subsequently, the image sensor 810 is disposed or mounted on the firstadhesive member 1700 b 1, exposed through the opening 801 in the printedcircuit board 800.

Subsequently, a wire connecting the terminal of the printed circuitboard 800 to the terminal of the image sensor 810 is formed through awire-bonding process.

In the case of FIGS. 14A and 14B, since the adhesive member 1700 b isformed and continuously maintained over the entire area of the firstregion S1 and the entire area of the second region S2 of the stiffener900-4, a gap or a region, in which the adhesive is not charged, is notpresent between the lower surface of the printed circuit board 800 andthe upper surface of the stiffener 900-4 or between the lower surface ofthe image sensor 810 and the upper surface of the stiffener.Accordingly, when wire bonding is performed between the image sensor andthe printed circuit board, wire bouncing does not occur, and thus thereliability of wire bonding is secured.

The camera module 200 according to the embodiment may include a printedcircuit board 800 having therein an opening 801 to allow the imagesensor 810 to be disposed therein in order to reduce the height of thecamera module 200.

In addition, the camera module 200 according to the embodiment mayinclude a stiffener 900, which supports the printed circuit board 800and on which the image sensor 810 is mounted in order to dissipate theheat generated from the image sensor 810.

The height of the camera module is proportional to the thickness of thestiffener. In the case of reducing the thickness of the stiffener inorder to reduce the height of the camera module, the flatness of thestiffener 900, on which the image sensor is mounted, may bedeteriorated, and the optical performance of the camera module may bedeteriorated.

As shown in FIG. 3 , the embodiment includes the stiffener 900 havingthe protruding portion 901, on which the image sensor 810 is mounted,thereby improving the flatness of the stiffener 900, thus improving theoptical performance of the camera module.

In addition, the embodiment selectively adopts the shape of thestiffener of the embodiment of FIG. 3 or the shape of the stiffener ofthe embodiment of FIG. 6 depending on the thickness of the image sensorand the thickness of the printed circuit board, thereby reducing theheight difference between the image sensor 810 and the printed circuitboard 800 in the optical-axis direction, thus securing reliability ofwire bonding.

In addition, as shown in FIGS. 4A and 4B, in the embodiment, an unevenportion is formed on the protruding portion 901 of the stiffener 900, onwhich the image sensor is mounted, thereby increasing the bonding forcebetween the stiffener and the image sensor and preventing deteriorationin the bonding force and contamination of the image sensor due tooverflow of the adhesive.

In addition, in the embodiment, the printed circuit board 800, thestiffener 900, the image sensor 810, and the adhesive member 1700 or1700 b are coupled through the method of FIGS. 7A to 7E, FIGS. 10A to10D, or FIGS. 14A and 14B. Thus, upon wire bonding for electricallyconnecting the printed circuit board 800 to the image sensor 810, it ispossible to suppress warpage of the printed circuit board 800 and thusto secure reliability of wire bonding.

The camera module according to the embodiment may be included in anoptical instrument for the purpose of forming an image of an objectpresent in a space using reflection, refraction, absorption,interference, and diffraction, which are characteristics of light, forthe purpose of increasing visibility, for the purpose of recording andreproduction of an image by a lens, or for the purpose of opticalmeasurement or image propagation or transmission. For example, theoptical instrument according to the embodiment may include a smartphoneand a portable terminal equipped with a camera.

FIG. 15 is a perspective view of a portable terminal 200A according toan embodiment, and FIG. 16 is a configuration diagram of the portableterminal 200A shown in FIG. 15 .

Referring to FIGS. 15 and 16 , the portable terminal 200A (hereinafterreferred to as a ″terminal″) may include a body 850, a wirelesscommunication unit 710, an A/V input unit 720, a sensor 740, aninput/output unit 750, a memory 760, an interface 770, a controller 780,and a power supply 790.

The body 850 shown in FIG. 15 has a bar shape, without being limitedthereto, and may be any of various types such as, for example, a slidetype, a folder type, a swing type, or a swivel type, in which two ormore sub-bodies are coupled so as to be movable relative to each other.

The body 850 may include a case (e.g. casing, housing, or cover)defining the external appearance thereof. For example, the body 850 maybe divided into a front case 851 and a rear case 852. A variety ofelectronic components of the terminal may be mounted in the space formedbetween the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast receiving module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The audio/video (A/V) input unit 720 serves to input audio signals orvideo signals, and may include a camera 721 and a microphone 722.

The camera 721 may include the camera module 200 or 200-1 according tothe embodiment shown in FIGS. 1 or 8 .

The sensor 740 may sense the current state of the terminal 200A, such asthe open or closed state of the terminal 200A, the location of theterminal 200A, the presence or absence of a user’s touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. For example, when the terminal 200A is aslide-type phone, whether the slide-type phone is open or closed may bedetected. In addition, the sensor 740 serves to sense whether power issupplied from the power supply 790 or whether the interface 770 iscoupled to an external device.

The input/output unit 750 serves to generate visual, audible, or tactileinput or output. The input/output unit 750 may generate input data tocontrol the operation of the terminal 200A, and may display informationprocessed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a display panel751, a sound output module 752, and a touchscreen panel 753. The keypadunit 730 may generate input data in response to input to a keypad.

The display panel 751 may include a plurality of pixels, the color ofwhich varies in response to electrical signals. For example, the displaypanel 751 may include at least one of a liquid crystal display, athin-film transistor liquid crystal display, an organic light-emittingdiode, a flexible display, or a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in a call-signal reception mode, a callmode, a recording mode, a voice recognition mode, or a broadcastreception mode, or may output audio data stored in the memory 760.

The touchscreen panel 753 may convert variation in capacitance, causedby a user’s touch on a specific region of a touchscreen, into electricalinput signals.

The memory 760 may store programs for the processing and control of thecontroller 780, and may temporarily store input/output data (e.g. aphone book, messages, audio, still images, pictures, and moving images).For example, the memory 760 may store images captured by the camera 721,for example, pictures or moving images.

The interface 770 serves as a passage for connection between theterminal 200A and an external device. The interface 770 may receive dataor power from the external device, and may transmit the same torespective components inside the terminal 200A, or may transmit datainside the terminal 200A to the external device. For example, theinterface 770 may include a wired/wireless headset port, an externalcharger port, a wired/wireless data port, a memory card port, a port forconnection of a device having an identification module, an audioinput/output (I/O) port, a video input/output (I/O) port, and anearphone port.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to voice calls, data communication, and video calls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be provided inside thecontroller 180, or may be provided separately from the controller 780.

The controller 780 may perform pattern recognition processing, by whichwriting or drawing input to the touchscreen is perceived as charactersor images.

The power supply 790 may supply power required to operate the respectivecomponents upon receiving external power or internal power under thecontrol of the controller 780.

The features, structures, effects and the like described above in theembodiments are included in at least one embodiment of the presentdisclosure, but are not necessarily limited to only one embodiment.Furthermore, the features, structures, effects and the like exemplifiedin the respective embodiments may be combined with other embodiments ormodified by those skilled in the art. Therefore, content related to suchcombinations and modifications should be construed as falling within thescope of the present disclosure.

INDUSTRIAL APPLICABILITY

The embodiments may be used in a camera module and an optical devicecapable of improving optical performance, securing reliability of wirebonding between a printed circuit board and an image sensor, andincreasing bonding force between a stiffener and the image sensor.

What is claimed is:
 1. A camera module, comprising: a stiffenercomprising a cavity recessed from an upper surface thereof; a printedcircuit board disposed on the stiffener and comprising a through holecorresponding to the cavity of the stiffener; an image sensor disposedon a bottom surface of the cavity of the stiffener; and a lens barreldisposed above the image sensor, wherein a depth from the upper surfaceof the stiffener to the bottom surface of the cavity is less than orequal to a thickness of the image sensor.
 2. The camera module accordingto claim 1, wherein the image sensor is attached to the bottom surfaceof the cavity by an adhesive member.
 3. The camera module according toclaim 1, wherein the thickness of the image sensor is greater than athickness of the printed circuit board.
 4. The camera module accordingto claim 1, wherein an uneven portion is formed in the bottom surface ofthe cavity.
 5. The camera module according to claim 4, wherein theuneven portion comprises convex portions and concave portions.
 6. Thecamera module according to claim 5, wherein the convex portions have aplurality of lines, a stripe shape, a net shape, a plurality of dots, ora plurality of islands.
 7. The camera module according to claim 1,wherein protrusion portions are formed in the bottom surface of thecavity.
 8. The camera module according to claim 1, comprising a wireconnecting the image sensor and the printed circuit board.
 9. The cameramodule according to claim 1, comprising an adhesive member disposedbetween the stiffener and the printed circuit board.
 10. The cameramodule according to claim 1, comprising: a holder disposed on theprinted circuit board; and a filter disposed on the holder and oppositeto the image sensor.
 11. The camera module according to claim 1, whereinthe image sensor is disposed within the through hole of the printedcircuit board, when viewed from a top.
 12. The camera module accordingto claim 1, wherein the stiffener is formed of a metal material.
 13. Thecamera module according to claim 1, wherein the stiffener is formed ofglass epoxy, plastic, or synthetic resin.
 14. The camera moduleaccording to claim 1, wherein an upper surface of the image sensor ispositioned lower than an upper surface of the printed circuit board. 15.The camera module according to claim 1, wherein the image sensor isspaced apart from a side surface of the cavity.
 16. A camera module,comprising: a stiffener comprising a cavity recessed from an uppersurface thereof; a printed circuit board disposed on the upper surfaceof the stiffener and comprising a through hole corresponding to thecavity; an image sensor disposed on a bottom surface of the cavity ofthe stiffener; a lens barrel disposed above the image sensor; and anadhesive member attaching the bottom surface of the cavity and the imagesensor, wherein the image sensor is disposed within the through hole ofthe printed circuit board, when viewed from a top, and wherein an uppersurface of the image sensor is positioned lower than an upper surface ofthe printed circuit board.
 17. The camera module according to claim 16,wherein a depth from the upper surface of the stiffener to the bottomsurface of the cavity is less than or equal to a thickness of the imagesensor.
 18. The camera module according to claim 16, wherein a thicknessof the image sensor is greater than a thickness of the printed circuitboard.
 19. The camera module according to claim 16, wherein an unevenportion comprising convex portions and concave portions is formed in thebottom surface of the cavity.
 20. A phone comprising the camera moduleaccording to claim 1.